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History Development
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Establish Date ：1997-05-29 | |
| 1997 | May | ●Located in Kaohsiung Taiwan. Htc capital has invested 5 millions and is specialized in Vacuum gauge, MFC assembly, manufacturing, selling and technical services offering. Also successfully developed PC607 which is the first in Taiwan a digital vacuum gauge product. |
| 1998 | June | ●Set up a new headquarters. With regards to the strong growth quality demands of semiconductor and related industrial, Htc built a new headquarters in Tshontolauo industrial zone Tainan Taiwan to achieve the highly demands on middle to long term semiconductor and related industrial requirements. |
| Sept. | ●Htc extended the capital, recruiting elites, integrating the supply chain of Vacuum technique and products in order to achieve the goal of long term capital organization. ●Capital increased to NTD190 million. The paid-in capital is NTD195 million and the organization had been changed to Limited Liability Company. | |
| 1999 | July | ●Move in new headquarters in Tainan. |
| 2000 | Mar. | ●Start-up new headquarters in Tainan. ●Contracted with Taiko Dry Vacuum Pump of Japan for exclusive agency of selling in Taiwan, and overhaul technique transferring, before. |
| 2001 | Jan. | ●Contracted with Chung-Shan Institute of Science and Technology for development and technique transferring of “Magnetic Liquid Sealing” |
| Apr. | ●Program of Mainland China Investment was approved by Investment commission, MOEA. | |
| May | ●Set up HTC Shanghai branch in Waigaoqiao TAX Free Trade Zone, it also includes service center, warehouse of free trade product, office and dormitory for supporting employees. | |
| 2002 | Jan. | ●Registered Emerging Market Stock in Taiwan. |
| June | ●Successfully developed and released new equipment of HFVCD which is vacuum coater for diamond film deposition. ●June Capital increase from earnings NTD 5 million, Paid-in capital was NTD 350 million. |
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| Dec. | ●Official listing in OTC | |
| 2003 | Jan. | ●Added a new department of parts clean in order to offer the refurbish & regenerating service for process equipment and components. ●Jan. Became an Omni-service Company. HTC imported the products of SII EDA of Japan company and step in software technique service field. |
| Apr. | ●Contracted with Industrial Technology Research Institute for technique transferring of thermal spray to promote the self-production of components in HTC Parts clean department. | |
| May | ●Invested HTS for system development and maintain service in microwave、RF & PLASMA power-supply. | |
| Aug. | ●Capital increase from earnings NTD 22.25 million, Paid-in capital was NTD 372.25 million. | |
| Nov. | ●For marketing growth, professional division, service standard procedure and core competitive advantages, Htc built a new branch in Hu-Ko Shin-Chu. The area measure equal to 800 square feet. To begin construction on June and finished also start up on November. | |
| Dec. | ●Extended a contract with BOCEJ of Japan for 3 years turbo pump agent. | |
| 2004 | Apr. | ●Considering the pump service business in the future, Htc extended an omni-repair service team of Turbo Pump, Dry Pump, Cryo Pump and Gate Valve products in Hsin-Chu branch. ●HtcVacuum system integration ability was certified. Assigned to produce PVD coating system instead of Japan system. ●SHtc(Htc Shanghai) move in Shanghai Baoshan industrial zone and start up 3 phase of foundry construction plan. For offering whole services of vacuum components, pump repair and parts clean service of semiconductor and optical-electronic industry. Htc set up a new foundry in order to satisfy the demands of speedy, services and production capacity in Mainland China. ●Obtained the patent of ”improvement in dry pump cooling mechanism” |
| May | ●Cooperated with MIRDC for development rotor & stator of Oil Rotary Vane Pump. | |
| Aug. | ●Capital increase from earnings NTD 61.686 million, Paid-in capital was NTD 435.951 million. | |
| Oct. | ●Set up equipment engineering department in Tainan headquarters. HTC equipment engineering department is specialized in whole dispenser & inspection system service, vacuum module, electricity-mechanic integration design, development process of semiconductor packaging, dispenser of LCD, driveIC, LCM, LED, equipment construction design, system control. | |
| Nov. | ●Obtained the patent of “Pump Vibration Free Mechanism”. | |
| Dec. | ●Spin-Off parts clean department to another new company, which isBOCET. HTC casts enormous fund in parts clean business to expand core competitive advantages and new markets. ●Contracted with BOC which is well-known international technology group for share transfer and cooperation agreement. HTC established partnership with top brand BOC Edwards Kachina. And share 50% share to BOC Holdings.BOCET became microelectronics manufacturing services provider for components and equipment supporting service. |
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| 2005 | Jan. | ●Contracted with ODEM which is the Vacuum manufacturer in Israel for 3 years product selling agent. ●Start factory construction of HTC Shanghai Baoshan factory. ●Developed newest oil pump and dry pump components. HTC provides repair kits, and build up pump design and production ability in order to extend the market of Europe, mainland China in order to get global orders. |
| Mar. | ●Divided the department of parts clean as a new company BOCT on March 31. | |
| Aug. | ●Obtained the patent of ”The construction and modification of vacuum valve”. ●Capital increase from earnings NTD 54.602 million, Paid-in capital was NTD 491.618 million. |
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| Sept. | ●Obtained the patent of “dry pump cooling system”, “clamp construction modification “ and “ultrasonic cleaning system”. | |
| Oct. | ●Obtained the patent of “clamp construction improvement”. | |
| 2006 | Jan. | ●Set up HTC e-Commerce Department. To promote HTC products and selling the products which was made and act as an agent by HTC. Directly to process all the orders from web site. ●Set up RFPS Department to develop the marketing promotion, information searching, market analysis, equipment production and maintaining service for RFPS. ●Obtained the patent of “ultrasonic cleaning process method”. |
| Mar. | ●Set up JEHTC company to expand the market of EDA system and develop software product business. | |
| Apr. | ●Issued domestic secured convertible bond NTD130 million and get approval | |
| 2007 | Jan. | ●Establishment of Research and Engineering Center. This center supervises, controls, and overall plans the researches and projects of Large Thin-Film Chamber and RFID equipments. |
| Apr. | ●Obtaining the certification of SGS OHSAS 18001：1999 | |
| July | ●Accomplishment of the second project of Shanghai Baoshan Factory. | |
| Aug. | ●Buying 50% stocks of Htc Solar Tech Service Limited from BOC Holdings ●Obtaining the orders of AUTO LAMP REFLECTION COATING CVD Polymer coating equipments from Stanley Co., an international major auto lamp factory. |
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| 2008 | Jan. | ●Accomplishment of the third project of Shanghai Baoshan Factory. |
| Apr. | ●Cooperation with Solar Applied Materials Technology Corporation in investing Htc Solar Tech Service Limited. | |
| Aug. | ●Development of Inline Sputter System Coating technology for solar cell | |
| Sept. | ●NT$ 22,641,100 of capital increasing out of earnings or capital reserves. | |