Feature:
- Roll-To-Roll Conveying for In-Line System.
- Integrated ACP/NCP, Flip-Chip, Pre-Bonder, Final-Bonder (Multi-Header) and
Tester into a product line.
- High Accuracy & Low Cost.
Application
| - Smart Label |
- Direct Chip Attach |
- Small HF & UHF Antenna. |
| - Smart Label |
- Strap Assembly |
- Multi-Row Straps |
Main Specifications
| 1 |
Sbstrate Size |
Antenna: 35 - 16 mm width
Strap: 35 - 160 mm width (multi-row) |
| 2 |
Wafer Size |
8" (max.) |
| 3 |
Die / Chip Size |
0.5 x 0.5 ~ 4 x 4 mm |
| 4 |
Accuracy for Die Rotation and Pick & Place |
 50  m(with vision system) |
| 5 |
Tape conveying accuracy |
50 m(with vision system) |
| 6 |
Adhesives |
ACP / NCP(Option) |
| 7 |
Facilities |
220 VAC / 3 Phase / 60Hz, Air: 5kgf.cm2(min.) |
| 8 |
Machine Dimensions |
Ref. 5100(W) x 1000(D) x 1800(H) mm |
