Vacuum Snap Cure Oven VSC-1904-S-XP | IC Dispensing Machine : Htc vacuum

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IC封止用ディスペンサー

Htc provide automatic precision dispenser Bonding of BEOL and IC snap cure oven, Widely used in IC dispensing packaging, optoelectronics, LCD / LED dispensing package. Graphical user interface easy to learn and easy to use, convenient and capacity management.

製品の内訳

ICから迅速な乾燥処理システムを可能にする

真空リフロー炉 VSC-1904-S-XP

Vacuum Snap Cure Oven VSC-1904-S-XP | IC Dispensing Machine : Htc vacuum

Dimension:
Footprint	2940(L) x 1930(W) x 2270(H)mm
Working Height	970~1020mm
Weight	Approx.2440kg
Application:
Leadframe Length	80~270mm
Leadframe Width	56~90mm
Cassette Length	90~280mm
Cassette Width	30~100mm
Cassette Height	120~160mm
Cassette Pitch	Programmable
Facilities:
Electric Supply	220 VAC,3Phase,50Hz
Power Consumption	12 KW max.
Compressed Air	4~6Bars
N₂ Supply	0~2 NL/Min
Hot Gas Supply	0~2 NL/Min
Exhaust	0~15 Nm³/hr(flowrate)
System and Operation:
Control System	PLC
Heating System	10x PID Heating Zone, 10x Curing Stations (1 Spare)
Control Panel	Touch Panel
Transfer Unit	Cable Wire Indexer
UPH:	Calculation base:(Example)
	a. 36 PCs on one strip
	b. Normal snap curing time:60 Secs
	UPH = 3600 (secs) x 36 (pcs/strip) x 10(zone)/60(secs)
Temperature Setting Range	25~ 400
Option:
Manual inspection Area	Manual operation